Using our Sonix at MEFAS we can nondestructively view internal discontinuities in your sample. Defects such as cracks, delaminations and voids are easily detectect using Scanning Acoustic Microscopy (SAM). Acoustic Microscopy is unparalleled in its ability to reveal delaminations, cracks and other anomalies nondestructively. Not only does Acoustic
Microscopy detect the failure but it also indicates the cause of the problem. In our failure analysis lab, Sonix SAM's high resolution images and advanced diagnostic tools are used to qualify new package designs, monitor production sampling and diagnose device failures.