MEFAS has three FEI 200xp and two dual beam FIB systems operating on two shifts available for your projects. The systems have platinum metal deposition, dielectric insulator deposition, and enhanced etch chemistries. Circuit Modifications - Copper and latest geometry technology modifications. Cut and jump IC modification is a cost efficient method to debug and make design changes prior to re-masking. Probe Pads - Deposit probe points for electrical characterization that are not accessible via conventional probing techniques. Wire Bond Pads - Deposit wire bonding pads for high current modifications. Precision Cross Sections - Perform precision cross sections with sub micron accuracy. Cross section photo resist, MEMS, and biological structures that do not lend themselves to conventional mechanical cross section techniques.
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