Device Level FA

System Level FA

Light Emission Microscopy (LEM)

Thermal Infrared Imaging

Externally Induced Voltage Alterations (XIVA)

Transmission Line Pulse Testing (TLP)

DC Charcterization

Mechanical Microprobe

Scanning Electron Microscopy (SEM)

Energy Dispersive Spectroscopy (EDS)

High Resolution Real Time X-ray Imaging

High Resolution Scanning Acoustic Microscopy (SAM)

Wire Bond and Solder Ball Bond Strength Testing

Device Construction Analysis

Sample Preparation Services
 Backside Sample Milling
 Parallel Lapping
 Cross-section
 Device Decapsulation
 Plasma Etching
 Laser Cutting

Scanning Electron Microscopes (SEMI)
JEOL 6340F semi in-lens field emission
Hitachi S4500 semi in-lens field emission

Surface Analysis
Noran Energy Dispersive Spectroscopy (EDS)

Focused Ion Beam System (FIB)
FEI 200xp systems (3)

Scanning Acoustic Microscopy (LEM)
Sonix UHR2000

Light emission microscopy (LEM)
Alpha Innotech 2000 w/ Enclosed Probe Station System

Micro Probe Station
Alessi high precision 8" stations

Optical Microscopy
Olympus (3000X) microscopy systems (3)
Leica (130X) stereo microscopy inspection systems (2)
Panasonic macro camera system

Package Decapsulation
Nisene D cap system
B&G 250 system

IC Depassivation System
March Instruments CS1701 RIE Plasma

X-ray Imaging
Phoenix- pcba/inspector real time x-ray system

Wire, Solder Ball, & Die Strength Test
Royce Instruments 552 Universal Bond Tester

Selected Area Polisher
Ultra Tec ASAP-1

Metallography
(6) Buehler variable speed wheels
(1) Allied high tech planar polishing system

Electrical Bench Equipment
Numerous assorted test equipment