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A construction analysis
is often performed on devices to determine quality, reliability, technology,
patent infringement, etc.
Some typical requirements
in a construction analysis may include:
- External visual
examination
- X-ray inspection
- Scanning acoustic
microscopy inspection
- Internal optical
visual examination
- Internal SEM
review
- Interconnect
bond strength determination
- Mechanical cross
sections
- Elemental analysis
of various materials, plating, thin films, etc…
- High magnification
SEM documentation
- Dimensional measurements
- Seal testing
- Internal water
vapor determination
- Solderability
verification
- Detailed optical
imaging of circuitry
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